Hygon C86 3250

Hygon C86 3250

CPU
-
发布日期:2026-02-24

The Hygon C86 3250 was a desktop processor with 8 cores, launched in March 2018. It is part of the C86-3G lineup, using the Zen (Dhyana) architecture with . Thanks to the core-count is effectively do

产品图集

Hygon C86 3250 - 图片1

产品详情

The Hygon C86 3250 was a desktop processor with 8 cores, launched in March 2018. It is part of the C86-3G lineup, using the Zen (Dhyana) architecture with . Thanks to the core-count is effectively doubled, to 16 threads. C86 3250 has 16 MB of L3 cache and operates at 2.8 GHz by default, but can boost up to 3 GHz, depending on the workload. Hygon is building the C86 3250 on a 14 nm production process using 4,800 million transistors. The silicon die of the chip is not fabricated at Hygon, but at the foundry of GlobalFoundries. The multiplier is locked on C86 3250, which limits its overclocking capabilities.
With a TDP of 90 W, the C86 3250 consumes a good deal of power, so decent cooling is needed. Hygon's processor supports DDR4 memory with a dual-channel interface. The highest officially supported memory speed is 2666 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the machine, C86 3250 uses a PCI-Express Gen 3 connection. This processor does not have integrated graphics, you will need a separate graphics card.
Hardware virtualization is available on the C86 3250, which greatly improves virtual machine performance.

基础信息

型号Hygon C86 3250
品牌
分类CPU
参考价格-
发布日期2026-02-24

CPU特性参数

核心数8
线程数16
基础频率2.80 GHz
加速频率3.00 GHz
基础时钟100.00 MHz
倍频28.00x
倍频解锁
制程工艺14 nm
TDP功耗90 W
代号Dhyana
代次C86-3G (Zen (Dhyana))
市场定位Desktop
型号/部件号unknown
代工厂GlobalFoundries
晶体管数量4,800 million
芯片尺寸213 mm²
封装类型FC-BGA
内存支持DDR4
内存速度2666 MT/s
内存总线Dual-channel
内存带宽42.7 GB/s
ECC内存支持
PCIe版本Gen 3
PCIe通道数32
L1缓存96 KB (per core)
L2缓存512 KB (per core)
L3缓存16 MB
集成显卡N/A

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